Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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*[[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | *[[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | ||
*[[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | *[[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | ||
* [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]] | *[[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]] | ||
== Comparison of equipment/material == | |||
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | |||
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|-style="background:silver; color:black" | |||
! Polymers | |||
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | |||
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] | |||
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | |||
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]] | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Generel description | |||
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process) | |||
|Plasma Enhanced Chemical Vapour Deposition (PECVD process) | |||
|Reactive sputtering | |||
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|-style="background:LightGrey; color:black" | |||
!Allowed materials | |||
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*Silicon | |||
*Silicon oxide | |||
*Silicon nitride | |||
*Pure quartz (fused silica) | |||
Processed wafers have to be RCA cleaned | |||
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*Silicon | |||
*Silicon oxide (with boron, phosphorous and germanium) | |||
*Silicon nitrides (with boron, phosphorous and germanium) | |||
*Pure quartz (fused silica) | |||
|Any | |||
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