Revision as of 11:34, 6 October 2014

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Direct Structure Definiton

By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps.

Advantages of direct structure definition may be ..

Quicker process because no need for masking steps
In some cases the structure is defined directly by a computer, so changes in the design can be made very quickly.

Dis-advantages could be

Limited choice of materials
Limited resolution

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Choose method of structuring

Materials for structuring

Polymers
- SU-8
  - UV Lithography
- Topas
- PMMA
  - Nano Imprint Lithography
- AZ resists
  - 2-Photon Polymerization Lithography
- ...
Metals
- Laser ablation
Silicon
- Laser ablation
Glass
- Laser ablation
- Sandblasting (at DTU Nanotech).

Choose equipment

Comparison of equipment/material

Polymers

Nano Imprint Lithography

2-Photon Polymerization Lithography

Polymer Injection Molder

Laser Micromachining Tool

Generel description

Low Pressure Chemical Vapour Deposition (LPCVD furnace process)

Plasma Enhanced Chemical Vapour Deposition (PECVD process)

Reactive sputtering

Allowed materials

Silicon
Silicon oxide
Silicon nitride
Pure quartz (fused silica)

Processed wafers have to be RCA cleaned

Silicon
Silicon oxide (with boron, phosphorous and germanium)
Silicon nitrides (with boron, phosphorous and germanium)
Pure quartz (fused silica)

Any

@@ Line 50: / Line 50: @@
 *[[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
 *[[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
-* [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]]
+*[[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]]
+== Comparison of equipment/material ==
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-
+|-style="background:silver; color:black"
+! Polymers
+![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
+![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
+![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
+![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Generel description
+|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
+|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
+|Reactive sputtering
+|
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Allowed materials
+|
+*Silicon
+*Silicon oxide
+*Silicon nitride
+*Pure quartz (fused silica)
+Processed wafers have to be RCA cleaned
+|
+*Silicon
+*Silicon oxide (with boron, phosphorous and germanium)
+*Silicon nitrides (with boron, phosphorous and germanium)
+*Pure quartz (fused silica)
+|Any
+|-
+|}
+<br clear="all" />