Specific Process Knowledge

2nd Level - Process Topic

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Choose the process topic you are interested in

• Back-end processing

• Characterization

• Direct Structure Definition

• Doping

• Etch

• Imprinting

• Lithography

• Thermal Process

• Thin film deposition

• Wafer and sample drying

• Wafer Bonding

• Wafer Cleaning

• Wafer Information

• III-V Process

Overview of sample processing

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Clean your sample	Dry your sample	Create a thin film on your sample	Dope your sample
Thermal treatment of your sample	Make a mask on your sample	Transfer pattern to your sample	Define your structure directly
Bond your samples together	Characterize your sample	Pack your sample

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Clean your sample
Entry page in LabAdviser	Techniques	Materials
Wafer cleaning	Soap Sonic	Removes dust and particles
	7-up & Piranha	Removes organics and alkali ions
	RCA	Two step process to remove organics and metals
	5% HF	Removes native oxide
	IMEC	Removing dust, organics and alkali ions and slightly polish the surface. Make the surface hydrophillic

Dry your sample
Entry page in LabAdviser	Techniques	Materials
Wafer and sample drying	Spin dryers	Whole wafers
	Critial point dryer	Sensitive wafers

Create a layer/film on your sample
Entry page in LabAdviser	Techniques	Materials
Thermal Process/Oxidation	Thermal oxidation	Thermal SiO2
Thin film deposition
	Sputter deposition	Si,SiO2,Si3N3,TiO2, metals
	Thermal evaporation	Al, ?
	E-beam evaporation	Metals
	LPCVD	Si3N4, SRN, SiO2, Si (poly and amorph)
	PECVD	Si3N4, SiO2, PBSG
	Electroplating	Ni
	Epitaxial growth /MOCVD	?
Lithography/Coaters
	Spin coating	resists, polymers
	Spray coating	resists, polymers

Dope your sample
Entry page in LabAdviser	Techniques	Materials
Thin film deposition/PECVD	PECVD	Deposition of SiO2 or Si3N4 doped with P,B and Ge
Thin film deposition/Furnace LPCVD PolySilicon	LPCVD	Deposition of PolySi doped with B or P
Thermal Process/Dope with Boron	Predeposition and drive-in	Doping Silicon wafers with boron
Thermal Process/Dope with Phosphorus	Predeposition and drive-in	Doping Silicon wafers with phosphorus
Doping	Ion implant	?

Thermal treatment of your sample
Entry page in LabAdviser	Techniques	Materials
Thermal Process	Annealing	Si, PECVD layers
	Oxidation	Si wafers
	Doping with B/P	Si wafers
	Pyrolysis	Resists?
	Rapid Thermal Anneal (RTP)	?

Make a mask on your sample
Entry page in LabAdviser	Techniques	Materials
Lithography
	Photolithography	UV resists
	Deep UV lithography	DUV resists
	E-beam lithography	E-beam resists
	Imprinting	Polymers
	Lift-off	mostly used for making metal masks

Transfer mask pattern to your sample
Entry page in LabAdviser	Techniques	Materials
Etch
	Wet etch	Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
	Dry etch	Any material
Lithography/Lift-off		?

Define your structure directly
Entry page in LabAdviser	Techniques	Materials
Imprinting	Imprinting	Polymers
Direct Structure Definition	LASER machining
Lithography	Lithographic definition	Resists
Direct Structure Definition	Polymer Injection molding	Polymers

Bond your samples together
Entry page in LabAdviser	Techniques	Materials
Bonding	Eutectic bonding
	Fusion bonding
	Anodic bonding

Characterize your sample
Entry page in LabAdviser	What do you need to measure?	Technique/Method
Characterization	Sample Imaging, XY dimensions	Microscopy: optical,SEM,AFM
	Sample Topography	AFM,Profiling with stylus or optical
	Film thickness and optical constants	Ellipsometry,Reflectometry,Prism Coupling
	Film Stress	Profiling with stylus or optical
	Wafer thickness
	Element analysis	XPS,EDX,SIMS
	Contact Angle
	Resistivity	Four point probe
	Doping level/Carrier density
	Photoluminescence

Pack your sample (back-end)
Entry page in LabAdviser	Techniques	Materials
Back-end processing	Chip/die mounting
	Wire bonding
	Dicing

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