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Specific Process Knowledge/Thermal Process/Oxidation/Wet oxidation C1 furnace: Difference between revisions

Paphol (talk | contribs)
Paphol (talk | contribs)
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====Results (1)====
====Results (1)====


The figure 1 shown that the silicon dioxide thickness over the boat is affected the most by process time, temperature and steamer flow rate respectively. When the process time, temperature and steamer flow rate increase, the silicon dioxide thickness also increases. Since the steamer flow has the least an effect to the silicon dioxide thickness, so the flow rate has been fixed at 10 liter per minutes in the furnace recipe.
The figure 1 shows that the silicon dioxide thickness over the boat is affected the most by process time, temperature and steamer flow rate respectively. When the process time, temperature and steamer flow rate increase, the silicon dioxide thickness also increases. Since the steamer flow has the least an effect to the silicon dioxide thickness, so the flow rate has been fixed at 10 liter per minutes in the furnace recipe.




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The percent of film non-uniformity over the boat most likely depends on the silicon dioxide thickness. The thicker silicon dioxide gives better film uniformity. The figure 1 shown that the percent of film non-uniformity over the boat decreases, when the process time, steamer flow rate and the temperature increase.
The percent of film non-uniformity over the boat most likely depends on the silicon dioxide thickness. The thicker silicon dioxide gives better film uniformity. The figure 1 shows that the percent of film non-uniformity over the boat decreases, when the process time, steamer flow rate and the temperature increase.




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The figure 3 shown that the percent different of silicon dioxide thickness deceases when the process temperature and time increase, which means that the steamer flow rate has less effect on the thicker silicon dioxide film.
The figure 3 shows that the percent different of silicon dioxide thickness deceases when the process temperature and time increase, which means that the steamer flow rate has less effect on the thicker silicon dioxide film.


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