Specific Process Knowledge/Thermal Process/Oxidation/Wet oxidation C1 furnace: Difference between revisions
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From figure 5 | From figure 5 shows that the percent of film non-uniformity deceases when the process time and process temperature increase. From this experiment, show that the silicon dioxide has a very good uniformity. The percent of film non-uniformity is lower than 1.5 over the boat, and lower than 1.2 over the wafer. | ||
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