Specific Process Knowledge/Lithography/CSAR: Difference between revisions

Revision as of 09:50, 10 September 2014 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Wafer 3.05 ← Older edit		Revision as of 09:52, 10 September 2014 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →wafer 6.13 Newer edit →
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	~~===~~ wafer ~~6.13 ===~~		So far (Aeptember 2014) three wafers with CSAR have been e-beam exposed with dosetests and inspected in SEM. Thickness of resist, e-beam dose and development time has been changed somewhat from wafer to wafer: