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Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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= Alignment of exposure to existing pattern on wafer =
= Alignment of exposure to existing pattern on wafer =
If you need to align an exposure to an existin pattern on a wafer you need wafer marks (or global marks):


[[Image:P and Q marks.png|right|250px]]
[[Image:P and Q marks.png|right|250px]]


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A set of global marks are needed in order to align an exposure to an existing pattern on a wafer. These marks should be clearly visible in a 100keV SEM, i.e. preferably defined by Ti/Au or another 'heavy' metal. Etched global marks or global marks defined by a light metal as Al can be hard to locate manually as well as automatically.
'''1 Material:''' These marks should be clearly visible in a 100keV SEM, i.e. preferably defined by Ti/Au or another 'heavy' metal. Etched global marks or global marks defined by a light metal as Al can be hard to locate manually as well as automatically.


You need at least two wafer marks, a P mark and a Q mark. It is recommended to have many P and Q marks available on the wafer to choose from. The x-coordinate of the P mark should be smaller than the X-coordinate of the Q mark.
You need at least two wafer marks, a P mark and a Q mark. It is recommended to have many P and Q marks available on the wafer to choose from. The x-coordinate of the P mark should be smaller than the X-coordinate of the Q mark.