Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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| Line 266: | Line 266: | ||
= Alignment of exposure to existing pattern on wafer = | = Alignment of exposure to existing pattern on wafer = | ||
[[Image:P and Q marks.png| | [[Image:P and Q marks.png|right|250px]] | ||
{| cellpadding="2" style="border: 1px solid darkgray;" align="right" | {| cellpadding="2" style="border: 1px solid darkgray;" align="right" | ||
! width=" | ! width="150" | | ||
! width="150" | | ! width="150" | | ||
|- border="0" | |- border="0" | ||
| [[File:mark example.png|120px]] | | [[File:mark example.png|120px]] | ||
| [[File:GlobalMark.png|120px]] | | [[File:GlobalMark.png|120px]] | ||
|- align="center" | |- align="center" | ||
| Correct mark || not | | Correct mark || Text around mark not recommended | ||
|} | |} | ||