Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 123: | Line 123: | ||
R = k<sub>0</sub> [H<sub>2</sub>O]<sup>4</sup> [KOH]<sup>0.25</sup> e<sup>-E<sub>a</sub>/kT</sup>, | R = k<sub>0</sub> [H<sub>2</sub>O]<sup>4</sup> [KOH]<sup>0.25</sup> e<sup>-E<sub>a</sub>/kT</sup>, | ||
where k<sub>0</sub> = 2480 µm/hr, E<sub>a</sub> = 0.595 eV | where k<sub>0</sub> = 2480 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.595 eV for Si(100) | ||
and k<sub>0</sub> = 4500 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.60 eV for Si(110) | |||