Specific Process Knowledge/Lithography/CSAR: Difference between revisions
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|Zeiss SEM Supra 60VP, D-3 | |Zeiss SEM Supra 60VP, D-3 | ||
|2 kV, shortest working distance possible, chip mounted with Al tape | |2-3 kV, shortest working distance possible, chip mounted with Al tape | ||
|The wafers are diced into smaller pieces and sputter coated with Pt at DTU CEN before SEM inspection; please contact mailto:ramona.mateiu@cen.dtu.dk|Ramona Valentina Mateiu for further information. | |The wafers are diced into smaller pieces and sputter coated with Pt at DTU CEN before SEM inspection; please contact [mailto:ramona.mateiu@cen.dtu.dk|Ramona Valentina Mateiu] for further information. | ||
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