Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
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|Possible masking materials: | |Possible masking materials: | ||
| | |Stoichiometric Si<math>_3</math>N<math>_4</math> | ||
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Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||