Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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Please contact [mailto:lithography@danchip.dtu.dk Lithography] if you wish to test this material. | Please contact [mailto:lithography@danchip.dtu.dk Lithography] if you wish to test this material. | ||
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" style="width: 30%;" | |||
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|-style="background:Black; text-align:left; color:White" | |||
!Process | |||
!Parameters | |||
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|-style="background:WhiteSmoke; color:black" | |||
|Resist | |||
|AR-P 6200/2 AllResist E-beam resist | |||
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|-style="background:WhiteSmoke; color:black" | |||
|Spin Coat | |||
|1 min @ 6000 rpm, 4000 1/s2, softbake 1 min @ 150 degC, thickness ~140nm | |||
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|-style="background:WhiteSmoke; color:black" | |||
|E-beam exposure | |||
|0.2 nA, aperture 5, dose 207-242 muC/cm2, SHOT A,10 | |||
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|-style="background:WhiteSmoke; color:black" | |||
|Developing | |||
|SX-AR 600-54/6 60 sec, 60 sec IPA rinse | |||
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|-style="background:WhiteSmoke; color:black" | |||
|Characterization | |||
|Nikon ECLIPSE optical microscope, E-5 | |||
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|} | |||
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