Specific Process Knowledge/Lithography/CSAR: Difference between revisions
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== SEM pictures == | == SEM pictures == | ||
The wafers are diced into smaller pieces and sputter coated with Pt at DTU CEN before SEM inspection; please contact [mailto:ramona.mateiu@cen.dtu.dk|Ramona Valentina Mateiu] for further information. | |||
'''50nm''' | '''50nm''' |
Revision as of 11:01, 7 July 2014
These tests are currently in progress and this page thus under construction. If you have questions to the process or wish to use this e-beam resist, please contact Tine Greibe at tigre@danchip.dtu.dk.
Process Flow
Test of Chemically Semi-Amplified Resist (CSAR); a positive e-beam resist from AllResist (AR-P 6200-2).
Equipment | Process Parameters | Comments | |
---|---|---|---|
Pretreatment | |||
4" Si wafers | No Pretreatment | ||
Spin Coat | |||
Spin Coater Manual, LabSpin, A-5 | AR-P 6200/2 AllResist E-beam resist
60 sec at various spin speed. Acceleration 4000 s-2, softbake 1 - 5 min at 150 deg Celcius |
Disposal pipette used; clean by N2-gun before use. Use approximately 1.5 ml per 4" wafer, never use a pipette twice. Softbake is not a crucial step, see e-mail correspondence with AllResist here. | |
Characterization | |||
Ellipsometer VASE B-1 | 9 points measured on 100 mm wafer | ZEP program used; measured at 70 deg only | |
E-beam Exposure | |||
JEOL 9500 E-beam writer, E-1 | Dosepattern 15nm - 100nm,
dose 120-280 muC/cm2 |
Virtual chip mark height detection (CHIPAL V1) used in corner of every dose array | |
Development | |||
Fumehood, D-3 | 60 sec in X AR 600-54/6,
60 sec rinse in IPA, N2 Blow dry |
Gentle agitation while developing. After developing, wafer is immersed in beaker with IPA, subsequently blow dried with N2 gun. | |
Characterization | |||
Zeiss SEM Supra 60VP, D-3 | 2 kV, shortest working distance possible, chip mounted with Al tape | Before characterization, wafers were sputter coated with 2-3 nm Pt at DTU CEN. |
Spin Curves
The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. 9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.
AllResist AR-P 6200/2 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 09-04-2014. Softbake 5 min @ 150 degC. | ||||||
---|---|---|---|---|---|---|
Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
2000 | 4000 | 225.98 | 0.97 | |||
3000 | 4000 | 194.00 | 0.6 | |||
4000 | 4000 | 169.57 | 0.32 | |||
5000 | 4000 | 151.47 | 0.26 | |||
6000 | 4000 | 142.38 | 0.41 | |||
7000 | 4000 | 126.59 | 0.36 |
AllResist CSAR on Spin Coater: Manual LabSpin A-5, TIGRE, 16-06-2014. Softbake 2 min @ 150 degC. | ||||||
---|---|---|---|---|---|---|
Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
3000 | 4000 | 201.61 | 1.20 | |||
4000 | 4000 | 173.89 | 0.64 | |||
5000 | 4000 | 155.91 | 0.65 |
AllResist CSAR 1:1 in anisole, Spin Coater: Manual LabSpin A-5, TIGRE, 16-06-2014. Softbake 2 min @ 150 degC. | ||||||
---|---|---|---|---|---|---|
Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
2000 | 4000 | 83.48 | 0.49 | |||
3000 | 4000 | 67.12 | 0.41 | |||
4000 | 4000 | 58.64 | 0.44 | |||
5000 | 4000 | 53.13 | 0.39 | |||
6000 | 4000 | 48.76 | 0.38 |
SEM pictures
The wafers are diced into smaller pieces and sputter coated with Pt at DTU CEN before SEM inspection; please contact Valentina Mateiu for further information.
50nm
dose [muC/cm2] | 207 | 219 | 230 | 242 |
---|---|---|---|---|
30nm
dose [muC/cm2] | 207 | 219 | 230 | 242 |
---|---|---|---|---|