Specific Process Knowledge/Lithography/CSAR: Difference between revisions

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== SEM pictures ==
== SEM pictures ==


=== 50nm ===
'''50nm'''


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| [[File:CSAR50nmlines.png|250px]]
| [[File:CSAR50nmlines.png|250px]]
| [[File:CSAR50nmlines+5%.png|250px]]
| [[File:CSAR50nmlines+5%.png|250px]]
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'''30nm'''
{| cellpadding="2" style="border: 1px solid darkgray;" class="wikitable"
! width="100" | dose [muC/cm2]
! width="250" | 207
! width="250" | 219
! width="250" | 230
! width="250" | 242
|-
|
| [[File:CSAR30nmoverview-10%.png|250px]]
| [[File:CSAR30nmoverview-5%.png|250px]]
| [[File:CSAR30nmoverview.png|250px]]
| [[File:CSAR30nmoverview+5%.png|250px]]
|-
|
| [[File:CSAR30nmlines-10%.png|250px]]
| [[File:CSAR30nmlines-5%.png|250px]]
| [[File:CSAR30nmlines.png|250px]]
| [[File:CSAR30nmlines+5%.png|250px]]


|}
|}

Revision as of 10:39, 7 July 2014

These tests are currently in progress and this page thus under construction. If you have questions to the process or wish to use this e-beam resist, please contact Tine Greibe at tigre@danchip.dtu.dk.


Process Flow

Test of Chemically Semi-Amplified Resist (CSAR); a positive e-beam resist from AllResist (AR-P 6200-2).

Equipment Process Parameters Comments
Pretreatment
4" Si wafers No Pretreatment
Spin Coat
Spin Coater Manual, LabSpin, A-5 AR-P 6200/2 AllResist E-beam resist

60 sec at various spin speed. Acceleration 4000 s-2, softbake 1 - 5 min at 150 deg Celcius

Disposal pipette used; clean by N2-gun before use. Use approximately 1.5 ml per 4" wafer, never use a pipette twice. Softbake is not a crucial step, see e-mail correspondence with AllResist here.
Characterization
Ellipsometer VASE B-1 9 points measured on 100 mm wafer ZEP program used; measured at 70 deg only
E-beam Exposure
JEOL 9500 E-beam writer, E-1 Dosepattern 14nm - 100nm,

dose 120-280 muC/cm2

Virtual chip mark height detection
Development
Fumehood, D-3 60 sec in X AR 600-54/6,

60 sec rinse in IPA, N2 Blow dry

Agitation (by hand) while developing
Characterization
Zeiss SEM Supra 60VP, D-3 2 kV, shortest working distance possible, chip mounted with Al tape Before characterization, wafers were sputter coated with 2-3 nm Pt at DTU CEN.

Spin Curves

The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. 9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.

AllResist AR-P 6200/2 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 09-04-2014. Softbake 5 min @ 150 degC.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
2000 4000 225.98 0.97
3000 4000 194.00 0.6
4000 4000 169.57 0.32
5000 4000 151.47 0.26
6000 4000 142.38 0.41
7000 4000 126.59 0.36


AllResist CSAR on Spin Coater: Manual LabSpin A-5, TIGRE, 16-06-2014. Softbake 2 min @ 150 degC.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
3000 4000 201.61 1.20
4000 4000 173.89 0.64
5000 4000 155.91 0.65


AllResist CSAR 1:1 in anisole, Spin Coater: Manual LabSpin A-5, TIGRE, 16-06-2014. Softbake 2 min @ 150 degC.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
2000 4000 83.48 0.49
3000 4000 67.12 0.41
4000 4000 58.64 0.44
5000 4000 53.13 0.39
6000 4000 48.76 0.38


SEM pictures

50nm

dose [muC/cm2] 207 219 230 242


30nm

dose [muC/cm2] 207 219 230 242