Specific Process Knowledge/Lithography/CSAR: Difference between revisions
| Line 92: | Line 92: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|Zeiss SEM Supra 60VP, D-3 | |Zeiss SEM Supra 60VP, D-3 | ||
| | |2 kV, shortest working distance possible, chip mounted with Al tape | ||
|Before characterization, wafers were sputter coated with 2-3 nm Pt at DTU CEN. | |Before characterization, wafers were sputter coated with 2-3 nm Pt at DTU CEN. | ||
|- | |- | ||