Specific Process Knowledge/Doping

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Doping your wafer

This page is about doping your wafer or making a thin film layer doped with boron, phosphor or Germane.

• PECVD - Making boron glass (BSG), phosphorus glass (PSG), boron-phosphorus glass PBSG or germanium doped glass
• Furnace LPCVD PolySilicon - Deposition of PolySi doped with B or P
• Dope with Boron - Doping Silicon wafers with boron by thermal predeposition and drive-in
• Dope with Phosphorus - Doping Silicon wafers with phosphorus by thermal predeposition and drive-in
• Ion implantation

Comparison method 1 and method 2 for the process

	Method 1	Method 2
Generel description	Generel description - method 1	Generel description - method 2
Parameter 1	A B	A B
Parameter 2	A B C	A
Substrate size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3

Ion implantation

Cannot be done at Danchip. We recommend ...