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Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,315 edits
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*[[/Critical Point Dryer|Critical Point Dryer]]
*[[/Critical Point Dryer|Critical Point Dryer]]
*[[/Spin Dryers|Spin Dryers]]
*[[/Spin Dryers|Spin Dryers]]
== Process information ==
Standard process is 120 seconds for 100mm wafers or 180 seconds for 150mm wafers, at 2000 RPM - drying only.
''If'' rinsing is used as well, the standard process is 60 seconds of rinse at 500 RPM, followed by 120/180 seconds of drying at 2000 RPM.
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