Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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	It can be a problem to take wafers from the sputter and into the other machines in the cleanroom, since it is not very clean. In principle the sputter should be the last step before you take your wafers out of the cleanroom. If you need to take process your wafers further please contact the PVD group so they can help you.		It can be a problem to take wafers from the sputter and into the other machines in the cleanroom, since it is not very clean. In principle the sputter should be the last step before you take your wafers out of the cleanroom. If you need to take process your wafers further please contact the PVD group so they can help you.

	Lift off should never be done in the normal lift off bath in RR4 it should always be done in the dedicated lift off bath ~~opposite~~ the sputter.		Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4 it should always be done in the dedicated lift-off bath in the fumehood next to the sputter.