Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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==Relative Sputter rates== | ==Relative Sputter rates== | ||
To use these charts, locate the material for which known conditions are available. Then | |||
multiply the rate by the relative factors to arrive at the estimated rate for the new material. | |||
For example, with previous data showing 3.5Å/s Aluminum at 100W, then Titanium at | |||
similar conditions will generate approximately | |||
(0.53/1.00)·3.5 Å/s ≅ 2 Å/s | |||
The rates in this table are calculated based on a 500V cathode potential. As the power is | |||
increased greater than two times the original rate, then the relative rate will drop slightly | |||
(up to 10%). For example, Aluminum at 250W | |||
Al250W = 0.9·Al100W·(P1/P0) | |||
0.9·3.5 Å/s·(250/100) ≅ 7.4 Å/s | |||
The rates in the ceramics table assume the use of an RF power supply and account for the | |||
partial duty cycle of the RF generator as compared to a DC supply. | |||
===Metals and semiconductors=== | ===Metals and semiconductors=== | ||
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