Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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 Contact the pvd-group if you have special needs (pvd@danchip.dtu.dk).
 ====Sputter rate====
+The sputter rate depends on
+* target material
+* gun power (increasing power gives in general higher rate). Be aware of limitations on the power for different materials.
+* chamber pressure (increasing pressure gives in general lower rate). Too low a pressure can make the plasma unstable.
+* gas in chamber (Ar, N2, O2 or mixture).
+In the tabel below there a given a list of relative sputter rates for different materials (Al is set to 1).
+This means that You can estimate the sputter rate for a new material if you have the rate for another material under the same conditions.
+I think this only works for non-reactive sputtering (i.e. with Ar as the gas).
 ==Overview of the performance of Sputter-System(Lesker) and some process related parameters==