Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride: Difference between revisions
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It is also possible to deposit silicon nitride using the Lesker sputter system. However, the process hasnot been tested yet, but the required sputter targets for nitride deposition are avaliable. | It is also possible to deposit silicon nitride using the Lesker sputter system. However, the process hasnot been tested yet, but the required sputter targets for nitride deposition are avaliable. | ||
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of low stress nitride using the 4" LPCVD nitride furnace|Deposition of low stress nitride using the 4" LPCVD nitride furnace]] | *[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of low stress nitride using the 4" LPCVD nitride furnace|Deposition of low stress nitride using the 4" LPCVD nitride furnace]] | ||
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace]] | *[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace]] | ||