Specific Process Knowledge/Lithography/ZEP520A: Difference between revisions
| Line 45: | Line 45: | ||
softbake 2 min at 180 deg Celcius | softbake 2 min at 180 deg Celcius | ||
|Resist poured directly from bottle or by use of disposable pipette<sup>1</sup> | |Resist poured directly from bottle or by use of disposable pipette<sup>1</sup> | ||
|TIGRE, 23-04-2014 | |TIGRE, 23-04-2014, 21-05-2014 | ||
|- | |- | ||
| Line 58: | Line 58: | ||
|9 points measured on 100 mm wafer | |9 points measured on 100 mm wafer | ||
|ZEP program used; measured at 70 deg only | |ZEP program used; measured at 70 deg only | ||
|TIGRE, 23-04-2014 | |TIGRE, 23-04-2014, 21-05-2014 | ||
|- | |- | ||