Specific Process Knowledge: Difference between revisions
| Line 273: | Line 273: | ||
|- | |- | ||
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Oxide growth]] | |[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Oxide growth]] | ||
| | |Furnaces | ||
| | |SiO2 | ||
|- | |- | ||
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | |[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | ||
| Line 282: | Line 282: | ||
| | | | ||
|Sputter deposition | |Sputter deposition | ||
| | |Si,SiO2,Si3N3,TiO2, metals | ||
|- | |- | ||
| | | | ||
|Thermal | |Thermal evaporation | ||
| | |Al, ? | ||
|- | |- | ||
| | | | ||
|E-beam evaporation | |E-beam evaporation | ||
| | |Metals | ||
|- | |- | ||
| | | | ||
|LPCVD | |LPCVD | ||
| | |Si3N4, SRN, SiO2, Si (poly and amorph) | ||
|- | |- | ||
| | | | ||
|PECVD | |PECVD | ||
| | |Si3N4, SiO2, PBSG | ||
|- | |- | ||
| | | | ||
|Electroplating | |Electroplating | ||
| | |Ni | ||
|- | |- | ||
|[[Specific Process Knowledge/Lithography/Coaters|Coating]] | |[[Specific Process Knowledge/Lithography/Coaters|Coating]] | ||
| Line 310: | Line 310: | ||
| | | | ||
|Spin coating | |Spin coating | ||
| | |resists, polymers | ||
|- | |- | ||
| | | | ||
|Spray coating | |Spray coating | ||
| | |resists, polymers | ||
|- | |- | ||
|Epitaxial growth | |Epitaxial growth | ||
| | |MOCVD | ||
| | |? | ||
|- | |- | ||
|} | |} | ||