Specific Process Knowledge: Difference between revisions
Line 267: | Line 267: | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Create a layer/film on your sample | ! Create a layer/film on your sample | ||
|- | |||
|Entry page in LabAdviser | |||
|Techniques | |||
|Materials | |||
|- | |- | ||
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Oxide growth]] | |[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Oxide growth]] | ||
| | |||
| | | | ||
|- | |- | ||
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | |[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | ||
| | |||
| | | | ||
|- | |- | ||
| | | | ||
|Sputter deposition | |Sputter deposition | ||
| | |||
|- | |- | ||
| | | | ||
|Thermal deposition | |Thermal deposition | ||
| | |||
|- | |- | ||
| | | | ||
|E-beam evaporation | |E-beam evaporation | ||
| | |||
|- | |- | ||
| | | | ||
|LPCVD | |LPCVD | ||
| | |||
|- | |- | ||
| | | | ||
|PECVD | |PECVD | ||
| | |||
|- | |- | ||
| | | | ||
|Electroplating | |Electroplating | ||
| | |||
|- | |- | ||
|[[Specific Process Knowledge/Lithography/Coaters|Coating]] | |[[Specific Process Knowledge/Lithography/Coaters|Coating]] | ||
| | |||
| | | | ||
|- | |- | ||
| | | | ||
|Spin coating | |Spin coating | ||
| | |||
|- | |- | ||
| | | | ||
|Spray coating | |Spray coating | ||
| | |||
|- | |- | ||
|Epitaxial growth | |Epitaxial growth | ||
| | |||
| | | | ||
|- | |- |
Revision as of 13:05, 12 June 2014
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction
Overview of sample processing
Clean the sample |
---|
Drying Samples |
---|
Thermal treatment of the sample |
---|
Make a mask on the sample |
---|
Lithography |
Imprinting |
Transfer pattern into the sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
---|
Characterize the sample |
---|
Back end of the sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |
Overview of sample processing 2
|
|
|
| ||||||||||||||||||||||||||||||
|
|
|
| ||||||||||||||||||||||||||||||
|
|
Overview of sample processing 3
Clean your sample |
---|
Drying your Samples |
---|
Create a layer/film on your sample | ||
---|---|---|
Entry page in LabAdviser | Techniques | Materials |
Thermal Oxide growth | ||
Thin film deposition | ||
Sputter deposition | ||
Thermal deposition | ||
E-beam evaporation | ||
LPCVD | ||
PECVD | ||
Electroplating | ||
Coating | ||
Spin coating | ||
Spray coating | ||
Epitaxial growth |
Thermal treatment of your sample |
---|
Make a mask on your sample |
---|
Lithography |
Imprinting |
Transfer mask pattern to your sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition on your sample |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding your samples together |
---|
Characterize your sample |
---|
Back end processing of your sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |