Specific Process Knowledge: Difference between revisions
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==Overview of sample processing== | ==Overview of sample processing 3== | ||
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Clean the sample | ! Clean the sample |} | ||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Drying Samples | ! Drying Samples |} | ||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Make a layer on the sample or Film Formation | ! Make a layer on the sample or Film Formation | ||
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|Thermal Oxide growth | |Thermal Oxide growth | ||
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! Thermal treatment of the sample | ! Thermal treatment of the sample | ||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Make a mask on the sample | ! Make a mask on the sample | ||
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|Lithography | |Lithography |
Revision as of 12:26, 12 June 2014
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Overview of sample processing
Clean the sample |
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Drying Samples |
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Thermal treatment of the sample |
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Make a mask on the sample |
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Lithography |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |
Overview of sample processing 2
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Overview of sample processing 3
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