Specific Process Knowledge: Difference between revisions
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==Overview of sample processing== | ==Overview of sample processing 3== | ||
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! Clean the sample | ! Clean the sample |} | ||
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! Drying Samples | ! Drying Samples |} | ||
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! Make a layer on the sample or Film Formation | ! Make a layer on the sample or Film Formation | ||
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|Thermal Oxide growth | |Thermal Oxide growth | ||
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! Thermal treatment of the sample | ! Thermal treatment of the sample | ||
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! Make a mask on the sample | ! Make a mask on the sample | ||
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|Lithography | |Lithography | ||
Revision as of 12:26, 12 June 2014
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Overview of sample processing
| Clean the sample File:Cleaning.jpg |
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| Drying Samples File:Drying.jpg |
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| Make a layer on the sample or Film Formation File:Making a layer 1.jpg | |
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| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of the sample File:Thermal treatment 1.jpg |
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Make a mask on the sample 
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| Lithography |
| Imprinting |
| Transfer pattern into the sample |
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| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |
Overview of sample processing 2
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Overview of sample processing 3
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