Specific Process Knowledge: Difference between revisions
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===The section below here is under construction [[Image:section under construction.jpg|70px]] === | ===The section below here is under construction [[Image:section under construction.jpg|70px]] === | ||
==Overview of sample processing== | |||
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! Clean the sample [[File:cleaning.jpg|50px]] | |||
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! Drying Samples [[File:drying.jpg|50px]] | |||
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! Make a layer on the sample or Film Formation [[File:Making a layer 1.jpg|40px]] | |||
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|Thermal Oxide growth | |||
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|Thin Film deposition | |||
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|Sputter deposition | |||
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|Thermal deposition | |||
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|E-beam evaporation | |||
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|CVD | |||
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|LPCVD | |||
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|PECVD | |||
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|Coating | |||
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|Spin coating | |||
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|Spray coating | |||
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|Electroplating | |||
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|Epitaxial growth | |||
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! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]] | |||
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! Make a mask on the sample [[File:Making a mask 1.jpg|40px]] | |||
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|Lithography | |||
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|Imprinting | |||
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! Transfer pattern into the sample | |||
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|Wet etch | |||
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|Dry etch | |||
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|Lift-off | |||
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! Direct structure definition | |||
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|Imprinting | |||
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|LASER machining | |||
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|Lithographic definition | |||
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|Polymer Injection molding | |||
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! Bonding samples together | |||
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! Characterize the sample | |||
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! Back end of the sample | |||
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|Chip/die mounting | |||
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|Wire bonding | |||
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|Dicing | |||
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==Overview of sample processing== | ==Overview of sample processing== | ||