Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
The section below here is under construction
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!Transfer pattern into the sample | ! Transfer pattern into the sample | ||
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|Wet etch | |Wet etch | ||
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!Direct structure definition | ! Direct structure definition | ||
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|Imprinting | |Imprinting | ||
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|Chip/die mounting | |Chip/die mounting | ||
Revision as of 16:58, 27 May 2014
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Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing
Clean the sample 
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Drying Samples 
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Make a layer on the sample 
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| Thermal Oxide growth | |
| Thin Film deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
Thermal treatment of the sample 
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Make a mask on the sample 
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| Lithography |
| Imprinting |
| Transfer pattern into the sample |
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| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |