Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
The section beneath is under construction
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!Clean the sample | !Clean the sample | ||
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{| class="wikitable collapsible | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Drying Samples | !Drying Samples | ||
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!Thermal treatment of the sample | !Thermal treatment of the sample | ||
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!Bonding samples together | !Bonding samples together | ||
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{| class="wikitable collapsible | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Characterize the sample | !Characterize the sample | ||
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Revision as of 15:22, 27 May 2014
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Choose the process topic you are interested in
The section beneath is under construction 
Overview of sample processing
| Clean the sample |
|---|
| Drying Samples |
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| Make a layer on the sample | |
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| Thermal Oxide growth | |
| Thin Film deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of the sample |
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| Make a mask on the sample | |
|---|---|
| Lithography | |
| Imprinting |
| Transfer pattern into the sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |