Specific Process Knowledge: Difference between revisions
Appearance
| Line 46: | Line 46: | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Make a layer on the sample | !Make a layer on the sample | ||
! | ! | ||
|- | |- | ||
|Thermal Oxide growth | |Thermal Oxide growth | ||
| | | | ||
|- | |- | ||
|Thin Film deposition | |Thin Film deposition | ||
| | | | ||
|- | |- | ||
| | | | ||
|Sputter deposition | |Sputter deposition | ||
|- | |- | ||
| | | | ||
|Thermal deposition | |Thermal deposition | ||
|- | |- | ||
| | | | ||
|E-beam evaporation | |E-beam evaporation | ||
|- | |- | ||
|CVD | |CVD | ||
| | | | ||
|- | |- | ||
| | | | ||
|LPCVD | |LPCVD | ||
|- | |- | ||
| | | | ||
|PECVD | |PECVD | ||
|- | |- | ||
|Coating | |Coating | ||
| | | | ||
|- | |- | ||
| | | | ||
|Spin coating | |Spin coating | ||
|- | |- | ||
| | | | ||
|Spray coating | |Spray coating | ||
|- | |- | ||
|Electroplating | |Electroplating | ||
| | | | ||
|- | |- | ||
|Epitaxial growth | |Epitaxial growth | ||
|- | |- | ||
Revision as of 14:18, 27 May 2014
Feedback to this page: click here
Choose the process topic you are interested in
The section beneath is under construction 
Overview of sample processing
| Clean the sample |
|---|
| Drying Samples |
|---|
| Make a layer on the sample | |
|---|---|
| Thermal Oxide growth | |
| Thin Film deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of the sample |
|---|
| Make a mask on the sample | |
|---|---|
| Lithography | |
| Imprinting |
| Transfer pattern into the sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
|---|
| Characterize the sample |
|---|
| Back end of the sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |