Specific Process Knowledge: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Make a layer on the sample
!Make a layer on the sample
!
!
!
|-
|-
|
|Thermal Oxide growth
|Thermal Oxide growth
|
|
|-  
|-  
|
|Thin Film deposition
|Thin Film deposition
|
|
|-
|-
|
|
|
|Sputter deposition
|Sputter deposition
|-
|-
|
|
|
|Thermal deposition
|Thermal deposition
|-
|-
|
|
|
|E-beam evaporation
|E-beam evaporation
|-
|-
|
|CVD
|CVD
|
|
|-
|-
|
|
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|LPCVD
|LPCVD
|-
|-
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|PECVD
|PECVD
|-
|-
|
|Coating
|Coating
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|
|-
|-
|
|
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|Spin coating
|Spin coating
|-
|-
|
|
|
|Spray coating
|Spray coating
|-
|-
|
|Electroplating
|Electroplating
|
|
|-
|-
|
|Epitaxial growth
|Epitaxial growth
|-
|-

Revision as of 14:18, 27 May 2014

2nd Level - Process Topic

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Overview of sample processing

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