Specific Process Knowledge: Difference between revisions
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!Direct structure definition | !Direct structure definition | ||
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|Imprinting | |||
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|LASER machining | |||
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|Lithographic definition | |||
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|Polymer Injection molding | |||
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!Bonding samples together | !Bonding samples together | ||
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!Back end of the sample | !Back end of the sample | ||
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|Chip/die mounting | |||
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|Wire bonding | |||
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|Dicing | |||
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Revision as of 14:15, 27 May 2014
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Sample processing:
Clean the sample |
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Drying Samples |
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Make a layer on the sample | ||
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Thermal Oxide growth | ||
Thin Film deposition | ||
Sputter deposition | ||
Thermal deposition | ||
E-beam evaporation | ||
CVD | ||
LPCVD | ||
PECVD | ||
Coating | ||
Spin coating | ||
Spray coating | ||
Electroplating | ||
Epitaxial growth |
Thermal treatment of the sample |
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Make a mask on the sample | |
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Lithography | |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |