Specific Process Knowledge: Difference between revisions

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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Direct structure definition
!Direct structure definition
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}  
|}  
**Imprinting
**LASER machining
**Lithographic definition
**Polymer Injection molding
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Bonding samples together
!Bonding samples together
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Back end of the sample
!Back end of the sample
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}
|}
**Chip/die mounting
**Wire bonding
**Dicing

Revision as of 14:15, 27 May 2014

2nd Level - Process Topic

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