Specific Process Knowledge: Difference between revisions

Make a layer on the sample
	Thermal Oxide growth
	Thin Film deposition
		Sputter deposition
		Thermal deposition
		E-beam evaporation
	CVD
		LPCVD
		PECVD
	Coating
		Spin coating
		Spray coating
	Electroplating
	Epitaxial growth

Thermal treatment of the sample

Make a mask on the sample

- Lithography
- Imprinting

Transfer pattern into the sample

- Wet etch
- Dry etch
- Lift-off

Direct structure definition

- Imprinting
- LASER machining
- Lithographic definition
- Polymer Injection molding

Bonding samples together

Characterize the sample

Back end of the sample

- Chip/die mounting
- Wire bonding
- Dicing

@@ Line 36: / Line 36: @@
 ===This section is under construction [[Image:section under construction.jpg|70px]] ===
 Sample processing:
-*Clean the sample
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-*Drying Samples
+!Clean the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Drying Samples
+|}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
 !Make a layer on the sample
 !
@@ Line 98: / Line 101: @@
 |}
-*Thermal treatment of the sample
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-*Make a mask on the sample
+!Thermal treatment of the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Make a mask on the sample
+|}
 **Lithography
 **Imprinting
-*Transfer pattern into the sample
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Transfer pattern into the sample
+|}
 **Wet etch
 **Dry etch
 **Lift-off
-*Direct structure definition
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Direct structure definition
+|}
 **Imprinting
 **LASER machining
 **Lithographic definition
 **Polymer Injection molding
-*Bonding samples together
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-*Characterize the sample
+!Bonding samples together
-*Back end of the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Characterize the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Back end of the sample
+|}
 **Chip/die mounting
 **Wire bonding
 **Dicing