Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
This section is under construction
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===This section is under construction [[Image:section under construction.jpg|70px]] === | ===This section is under construction [[Image:section under construction.jpg|70px]] === | ||
Sample processing: | Sample processing: | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Clean the sample | |||
|} | |||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Drying Samples | |||
|} | |||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Make a layer on the sample | !Make a layer on the sample | ||
! | ! | ||
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|} | |} | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Thermal treatment of the sample | |||
|} | |||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Make a mask on the sample | |||
|} | |||
**Lithography | **Lithography | ||
**Imprinting | **Imprinting | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Transfer pattern into the sample | |||
|} | |||
**Wet etch | **Wet etch | ||
**Dry etch | **Dry etch | ||
**Lift-off | **Lift-off | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Direct structure definition | |||
|} | |||
**Imprinting | **Imprinting | ||
**LASER machining | **LASER machining | ||
**Lithographic definition | **Lithographic definition | ||
**Polymer Injection molding | **Polymer Injection molding | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Bonding samples together | |||
|} | |||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Characterize the sample | |||
|} | |||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
!Back end of the sample | |||
|} | |||
**Chip/die mounting | **Chip/die mounting | ||
**Wire bonding | **Wire bonding | ||
**Dicing | **Dicing | ||
Revision as of 15:07, 27 May 2014
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Choose the process topic you are interested in
This section is under construction 
Sample processing:
| Clean the sample |
|---|
| Drying Samples |
|---|
| Make a layer on the sample | ||
|---|---|---|
| Thermal Oxide growth | ||
| Thin Film deposition | ||
| Sputter deposition | ||
| Thermal deposition | ||
| E-beam evaporation | ||
| CVD | ||
| LPCVD | ||
| PECVD | ||
| Coating | ||
| Spin coating | ||
| Spray coating | ||
| Electroplating | ||
| Epitaxial growth |
| Thermal treatment of the sample |
|---|
| Make a mask on the sample |
|---|
- Lithography
- Imprinting
| Transfer pattern into the sample |
|---|
- Wet etch
- Dry etch
- Lift-off
| Direct structure definition |
|---|
- Imprinting
- LASER machining
- Lithographic definition
- Polymer Injection molding
| Bonding samples together |
|---|
| Characterize the sample |
|---|
| Back end of the sample |
|---|
- Chip/die mounting
- Wire bonding
- Dicing