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Specific Process Knowledge/Lithography/ZEP520A: Difference between revisions

Tigre (talk | contribs)
Tigre (talk | contribs)
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|Spin Coater Manual, LabSpin, A-5
|Spin Coater Manual, LabSpin, A-5
|ZEP520A 1:1 E-beam resist
|ZEP520A 1:1 or ZEP520A 1:2 E-beam resist
60 sec at various spin speed.
60 sec at various spin speed.
Acceleration 4000 s-2,  
Acceleration 4000 s-2,  
softbake 2 min at 180 deg Celcius
softbake 2 min at 180 deg Celcius
|Resist poured directly from bottle or pippette
|Resist poured directly from bottle or disposable pipette
|TIGRE, 23-04-2014
|TIGRE, 23-04-2014 and 21-05-2014
|-
|-


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|9 points measured on 100 mm wafer
|9 points measured on 100 mm wafer
|ZEP program used; measured at 70 deg only
|ZEP program used; measured at 70 deg only
|TIGRE, 23-04-2014
|TIGRE, 23-04-2014 and 21-05-2014
|-
|-


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dose 120-280 muC/cm2
dose 120-280 muC/cm2
|Virtual chip mark height detection
|Virtual chip mark height detection
| TIGRE, 23-04-2014
| TIGRE
|-
|-


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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|Fumehood, D-3
|Fumehood, D-3
|60 sec in ,  
|60 sec in N50,  
60 sec rinse in IPA,  
60 sec rinse in IPA,  
N2 Blow dry
N2 Blow dry
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|}
|}


== Spin Curves ==
== Spin Curves ==