Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
No edit summary |
|||
| Line 5: | Line 5: | ||
[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 1st floor]] | [[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 1st floor]] | ||
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding. | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | ||