Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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==TPT Wire Bonder== | ==TPT Wire Bonder== | ||
[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, | [[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 1st floor]] | ||
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | ||
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==Ball Wire Bonder K&S 4524== | ==Ball Wire Bonder K&S 4524== | ||
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, | [[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]] | ||
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | [[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | ||