Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
| Line 3: | Line 3: | ||
== Die bonder (eutectic metal soldering) == | == Die bonder (eutectic metal soldering) == | ||
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Die-bonder Cammax EDB-80]] | [[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]] | ||
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | ||