Jump to content

Specific Process Knowledge/Etch/Wet III-V Etches: Difference between revisions

← Older editNewer edit →
VisualWikitext
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,142 edits
No edit summary
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,142 edits
Line 111: Line 111:
|}
|}


'''(1)''' Temperature of mixture is ~22 C (no heating during etch). data obtained using magnetic stirring with sample on flat basket. '''(2)''' Refrigerated H2O used during mixture of etch, and mixture kept at 17 C during etch. '''(3)''' 10:2:30 gives smoother etch than 10:2:60.
'''(1)''' Temperature of mixture is ~22 C (no heating during etch). Data is obtained using magnetic stirring with sample on flat basket. '''(2)''' Refrigerated H2O used during mixture of etch, and mixture kept at 17 C during etch. '''(3)''' 10:2:30 gives smoother etch than 10:2:60.


<br>
<br>
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/Wet_III-V_Etches"