Specific Process Knowledge: Difference between revisions
| Line 39: | Line 39: | ||
*Make a layer on the sample | *Make a layer on the sample | ||
**Thermal Oxide growth | **Thermal Oxide growth | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Col1_head | |||
! gkraetj | |||
|- | |||
|Col1_row | |||
|nvkwo | |||
|- | |||
|askldjg | |||
|asldtkhj | |||
|} | |||
**Thin Film deposition | **Thin Film deposition | ||
***PVD | ***PVD | ||
Revision as of 13:44, 30 April 2014
Feedback to this page: click here
Choose the process topic you are interested in
- Lithography - New entry by the 18th of September - take a look
This section is under construction 
Sample processing:
- Clean the sample
- Drying Samples
- Make a layer on the sample
- Thermal Oxide growth
| Col1_head | gkraetj |
|---|---|
| Col1_row | nvkwo |
| askldjg | asldtkhj |
- Thin Film deposition
- PVD
- Sputter deposition
- Thermal deposition
- E-beam evaporation
- CVD
- LPCVD
- PECVD
- Coating
- Spin coating
- Spray coating
- Electroplating
- PVD
- Epitaxial growth
- Thin Film deposition
- Thermal treatment of the sample
- Make a mask on the sample
- Lithography
- Imprinting
- Transfer pattern into the sample
- Wet etch
- Dry etch
- Lift-off
- Direct structure definition
- Imprinting
- LASER machining
- Lithographic definition
- Polymer Injection molding
- Bonding samples together
- Characterize the sample
- Back end of the sample
- Chip/die mounting
- Wire bonding
- Dicing