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Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE process trends: Difference between revisions

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==Rotation speed==
==Rotation speed==
The rotation is activated to get a good uniformity over the wafer. The minimum number of rotation to get a good uniformity is 100 rotation for the hole etch. the maximum rotation speed is 20rpm. That means that an etch shorter that 5min cannot obtain a very good uniformity.
The rotation is activated to get a good uniformity over the wafer. The minimum number of rotations to get a good uniformity is 100 rotations for the whole etch. the maximum rotation speed is 20rpm. That means that an etch shorter that 5 min cannot obtain a very good uniformity.
{| border="2" cellspacing="2" cellpadding="3"  
{| border="2" cellspacing="2" cellpadding="3"  
!Etch Length [min]
!Etch Length [min]
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