Specific Process Knowledge/Lithography/CSAR: Difference between revisions
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Revision as of 08:18, 11 April 2014
These tests are currently in progress and this page thus under construction. If you have questions to the process or wish to use this e-beam resist, please contact Tine Greibe at tigre@danchip.dtu.dk.
Process Flow
Test of Chemically Semi-Amplified Resist (CSAR); a positive e-beam resist from AllResist (AR-P 6200-2).
Equipment | Process Parameters | Comments | Initials and date |
---|---|---|---|
Pretreatment | |||
Si wafers | No Pretreatment | TIGRE, 08-04-2014 | |
Spin Coat | |||
Spin Coater Manual, LabSpin, A-5 | AR-P 6200/2 AllResist E-beam resist
60 sec at various spin speed. Acceleration 4000 s-2, softbake 5 min at 150 deg Celcius |
Resist poured directly from bottle | TIGRE, 09-04-2014 |
Characterization | |||
Ellipsometer VASE B-1 | 9 points measured on 100 mm wafer | ZEP program used; measured at 70 deg only | TIGRE, 09-04-2014 |
E-beam Exposure | |||
JEOL 9500 E-beam writer, E-1 | Dosepattern 14nm - 100nm,
dose 120-280 muC/cm2 |
Virtual chip mark height detection | TIGRE, 10-04-2014 |
Development | |||
Fumehood, D-3 | 60 sec in X AR 600-54/6,
60 sec rinse in IPA, N2 Blow dry |
Agitation (by hand) while developing | TIGRE, 10-04-2014 |
Characterization | |||
Zeiss SEM Supra 60VP, D-3 | TIGRE, ??-04-2014 |
Spin Curve
AllResist AR-P 6200/2 spinning on Manual Spinner LabSpin A-5, TIGRE, 09-04-2014 | ||||||
---|---|---|---|---|---|---|
Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
2000 | 4000 | 225.98 | 0.97 | |||
3000 | 4000 | 194.00 | 0.6 | |||
4000 | 4000 | 169.57 | 0.32 | |||
5000 | 4000 | 151.47 | 0.26 | |||
6000 | 4000 | 142.38 | 0.41 | |||
7000 | 4000 | 126.59 | 0.36 |