Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
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Deposition of TiW alloy can be done in the Wordentec. | Deposition of TiW alloy can be done in the Wordentec. | ||
'''Observe:''' ''right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.'' | |||
==Sputtering of TiW== | |||
* [[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] | |||
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Revision as of 13:18, 10 April 2014
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Deposition of TiW alloy can be done in the Wordentec.
Observe: right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.
Sputtering of TiW
| Sputter deposition (Wordentec) | |
|---|---|
| General description | Sputter deposition of TiW |
| Pre-clean | RF Ar clean |
| Layer thickness | . |
| Deposition rate | Depending on process parameters, see here. |
| Batch size |
|
| Allowed substrates |
|
| Allowed materials |
|
| Comments | TiW alloy: 10%/90% by weight |
Deposited rates
This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see here) and may change with these settings.
Deposited film characteristics
AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.