Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon'' | *[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon'' | ||
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide'' | *[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide'' | ||
*[[/Furnace LPCVD Nitride|nitrid test]] | |||
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*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||
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*[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | *[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | ||
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel'' | *[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel'' | ||
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