Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 14:39, 9 April 2014

3rd Level - Material/Method

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Dielectrica	Semicondutors	Metals	Alloys	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titanium Oxide	Silicon Germanium	Aluminium Titanium Chromium Nickel Copper Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy NiV alloy	SU8 Antistiction coating Topas PMMA

PVD	LPCVD	PECVD	ALD	Coaters	Others
Alcatel - E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater Hummer - Gold sputtering system Balzer Sputter coater - Gold sputtering system	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide nitrid test	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD Picosun R200 - Atomic layer deposition	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel

@@ Line 74: / Line 74: @@
 *[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
 *[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
+*[[/Furnace LPCVD Nitride|nitrid test]]
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 *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
@@ Line 84: / Line 85: @@
 *[[/MVD|MVD]] - ''Molecular Vapor Deposition''
 *[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
-*[[/Furnace LPCVD Nitride|nitrid test]]
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