Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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! Comment | ! Comment | ||
|For thicknesses above 200 nm | | | ||
permission is required | * For thicknesses above 200 nm permission is required | ||
|For thicknesses above 200 nm | * An adhesion layer (of Cr or Ti) is recommended under Au. | ||
permission is required | | | ||
* For thicknesses above 200 nm permission is required | |||
* An adhesion layer (of Cr or Ti) is recommended under Au. | |||
| | | | ||
|Used to gold sputter coating of | |Used to gold sputter coating of | ||