Specific Process Knowledge/Thin film deposition/ALD Picosun R200: Difference between revisions
Created page with " =ALD Picosun 200= '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/ALD_Picos..." |
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*Silicon | *Silicon | ||
*Silicon oxide | *Silicon oxide, silicon nitride | ||
* | *Quartz/fused silica | ||
*Al, Al<sub>2</sub>O<sub>3</sub> | *Al, Al<sub>2</sub>O<sub>3</sub> | ||
*Ti, TiO<sub>2</sub> | *Ti, TiO<sub>2</sub> | ||
*Pt | *Pt | ||
* | *Other metals (use carrier wafer) | ||
*Polymers (depending on the melting point/deposition temperature, use carrier wafer) | |||
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