Sputtering of Ti in Wordentec: Difference between revisions
New page: == Deposition rate == The deposition rate will change with the settings for pressure and effect. '''Pressure <math>1*10^{-2}</math> mbar, Effect 300 W''' The rate is established to b... |
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'''Pressure | '''Pressure 1*10<sup>-2</sup> mbar, Effect 300 W''' | ||
The rate is established to be 1.7 Å/s (in the center of the wafer, 1.3 Å/s at the edge). | The rate is established to be 1.7 Å/s (in the center of the wafer, 1.3 Å/s at the edge). | ||
Revision as of 08:51, 7 April 2014
Deposition rate
The deposition rate will change with the settings for pressure and effect.
Pressure 1*10-2 mbar, Effect 300 W
The rate is established to be 1.7 Å/s (in the center of the wafer, 1.3 Å/s at the edge).