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Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions

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|-  
|-  
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Batch size
! General description
|
|
* 4x 6" wafers or
 
* 4x 4" wafers or
* 4x 2" wafers
|
|
*1-25 wafers of 4"
 
*For other sizes ask the ThinFilm group
|
|
*24x 2" wafers or
 
*6x 4" wafers or
*6x 6" wafers
|   
|   
* Several small samples mounted with capton tape
 
* 1x 50 mm wafer
* 1x 100 mm wafer
* 1x 150 mm wafer
* 1x 200 mm wafer
|
|
*Up to 1x4" wafers
|-
*smaller pieces
|-style="background:LightGrey; color:black"
! Doping facility
|None
|Can be doped during deposition with Boron and/or Phosphorous
| None
|None
|None
 
 


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:WhiteSmoke; color:black"
! Pre-clean
! Pre-clean
|RF Ar clean
|RF Ar clean
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:LightGrey; color:black"
! Layer thickness
! Layer thickness
|10Å to about 3000Å
|10Å to about 3000Å
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|-
|-


|-style="background:LightGrey; color:black"
|-style="background:WhiteSmoke; color:black"
! Deposition rate
! Deposition rate
|Dependent on process parameters, but in the order of 1 Å/s. See more [[Specific Process Knowledge/Thin film deposition/Si sputter in PVD co-sputter/evaporation|here]]
|Dependent on process parameters, but in the order of 1 Å/s. See more [[Specific Process Knowledge/Thin film deposition/Si sputter in PVD co-sputter/evaporation|here]]
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:LightGrey; color:black"
! Process temperature
! Process temperature
| Option: heating wafer up to 400 deg C
| Option: heating wafer up to 400 deg C
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|-
|-
|-style="background:LightGrey; color:black"
 
|-style="background:WhiteSmoke; color:black"
! Step coverage
! Step coverage
|.
|.
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|-
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:LightGrey; color:black"
! Adhesion
! Adhesion
|.
|.
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|Bad for pyrex, for other materials we do not know
|Bad for pyrex, for other materials we do not know
|-
|-
|-style="background:WhiteSmoke; color:black"
! Batch size
|
* 4x 6" wafers or
* 4x 4" wafers or
* 4x 2" wafers
|
*1-25 wafers of 4"
*For other sizes ask the ThinFilm group
|
*24x 2" wafers or
*6x 4" wafers or
*6x 6" wafers
| 
* Several small samples mounted with capton tape
* 1x 50 mm wafer
* 1x 100 mm wafer
* 1x 150 mm wafer
* 1x 200 mm wafer
|
*Up to 1x4" wafers
*smaller pieces


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
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* Metals  
* Metals  
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Doping facility
|None
|Can be doped during deposition with Boron and/or Phosphorous
| None
|None
|None
|-style="background:WhiteSmoke; color:black"
! Comment
! Comment
|
|
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