Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=328 LabManager] | Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=328 LabManager] | ||
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==Process information== | ==Process information== | ||
[[Image:140 250 nm tilt22 (1).jpg|200×200px|right|thumb|The SEM picture of 250nm pillors and lines. Exposure dose is 140 J/m2.]] | |||
The users are not allowed to use the developer. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers for you. | The users are not allowed to use the developer. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers for you. | ||
We have observed that using automatic developing we can decrease the exposure dose for resolve the 250nm pillors structures comparing to dose needed for resolve the line the same size. | We have observed that using automatic developing we can decrease the exposure dose for resolve the 250nm pillors structures comparing to dose needed for resolve the line the same size. | ||
== Equipment performance and process related parameters == | == Equipment performance and process related parameters == | ||