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Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions

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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]])
|-  
|-  
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Batch size
! General description
| Sputter deposition of NiV
| Sputter deposition of NiV
|-


|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
*Pieces or
*1x4" wafer or
*1x6" wafer
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
Line 34: Line 29:
|About 10Å to 5000Å
|About 10Å to 5000Å
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
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|-
|-
|-style="background:WhiteSmoke; color:black"
! Batch size
|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
*Pieces or
*1x4" wafer or
*1x6" wafer
|-
|-style="background:LightGrey; color:black"
! Allowed substrates
|   
* Silicon wafers
* Quartz wafers
* Pyrex wafers
|
* Silicon wafers
* Quartz wafers
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Allowed materials
!Allowed materials
|
|
* Silicon
* Silicon

Revision as of 16:15, 26 March 2014

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Nickel Vanadium can be deposited by sputter evaporation. In the chart below you can compare the different deposition equipment.


Sputter deposition (PVD co-sputter/evaporation) Sputter deposition (Sputter-System Lesker)
General description Sputter deposition of NiV Sputter deposition of NiV
Pre-clean RF Ar clean RF Ar clean
Layer thickness About 10Å to 4000Å About 10Å to 5000Å
Deposition rate Depending on process parameters. Depending on process parameters.
Batch size
  • 12x2" wafers or
  • 12x4" wafers or
  • 4x6" wafers
  • Pieces or
  • 1x4" wafer or
  • 1x6" wafer
Allowed substrates
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
  • Silicon wafers
  • Quartz wafers
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Carbon
Comment Sputter target with NiV composition: Ni/V 93/7% Sputter target with NiV composition: Ni/V 93/7%
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