Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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[[Image:TPTWireBonder.jpg|300x300px|thumb|TPT Wire Bonder Building 346, 2nd floor]] | [[Image:TPTWireBonder.jpg|300x300px|thumb|TPT Wire Bonder Building 346, 2nd floor]] | ||
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | |||
The TPT Wire Bonder is a new machine bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | The TPT Wire Bonder is a new machine bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | ||
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Please be aware that the bonder only is operated by Danchip personal. | Please be aware that the bonder only is operated by Danchip personal. | ||