Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

@@ Line 15: / Line 15: @@
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+|E-beam deposition of Pt
-*Up to 1x4" wafers
+|E-beam deposition of Pt
-*smaller pieces
+|Sputter deposition of Pt
-|
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
-|
-*1x4" wafer or
-*1x6" wafer
-*smaller pieces
 |-
 |-style="background:LightGrey; color:black"
@@ Line 47: / Line 39: @@
 |10Å/s to 15Å/s
 |? Å/s to ? Å/s
+|-
+|-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|
+*1x4" wafer or
+*1x6" wafer
+*smaller pieces
+|-
 |-
-|-style="background:WhiteSmoke; color:black"
+|-style="background:LightGrey; color:black"
 !Allowed materials
@@ Line 82: / Line 89: @@
 * Carbon
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 ! Comment
 |