Specific Process Knowledge/Back-end processing/Laser Micromachining Tool

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Laser Micromachining Tool

Lasertool microSTRUCT vario (3D-Micromac AG)

Inside lasertool

The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.

The machine is located in the basement of building 346 under the cleanroom.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager: [1]

It is equipped with 2 high power lasers:

• a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this article: [2] ) with a pulse repetition rate from 200kHz up to 8000kHz.

  and a

• a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz.

The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc. It can produce features down to ~10µm size over a large area. It can scan over an area of up to ~15x15cm without moving the sample. By moving the sample on the large x-y-stage this area can be extended by stitching.

The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info here.

Technical specifications

• Spot size and optics

Frequency and wavelength

Picosecond 1064nm 532nm 355nm Frequency min 200 kHz 200 kHz 200 kHz Frequency max 8000 kHz 8000 kHz 8000 kHz Nanosecond 1064nm Frequency min 100kHz Frequency max 100kHz

Performances

Purpose	Patterning, milling and dicing substrates	Mainly for patterning, milling or dicing substrate with micrometric shapes and above (> 10µm)
Performances	Resolution	Down to 10µm with the blue laser (355nm). Depending on the depth wished.
	Maximum writing area	Depends of the optics. Max size : Blue (145x145mm) Green ( 165x165mm) Red (165x165mm)
	Output power @100%(laser TB width – picosecond)	Repetition rate : 200kHz 355nm : 11,93W 532nm : 24,62W 1064nm : 34,24W Repetition rate : 1000 kHz 355nm : 4,28W 532nm : 18,40W 1064nm : 40,09W Repetition rate : 1000 kHz 355nm : 0,26W 532nm : 4,82W 1064nm : 42,40W
	Output power@100(laser IPG – nanosecond)	Repetition rate : 100kHz 1064nm : 80W
Substrates	Material allowed	Silicon Silicon + Si3N4 and/or SiO2 Silicon with resist Aluminum Steel Pyrex Fused silicate (quartz) Topas
Substrates	Process parameters	Parameters Min Max Speed - 2000mm/s Fluence 0,01J/cm2 113J/cm2 Spot size 10µm 74µm Pulse energy 0,03µJ 800 µJ Pulse duration 10,4ps 105000ps Repetition rate 200 kHz 8000 kHz Peak irradiance 4GW/cm2 5400 GW/cm2 Process information Result from the acceptance test Results from Laser Micromachining Tool acceptance test Laser results details Silicon cutting and milling Borofloat glass cutting and milling Quartz cutting and milling Aluminium cutting and milling Nickel cutting and milling (for Polymer Injection Molder) Mask making Laser Processing details Material Optics Frequency Intensity Power measured @10% Writing speed Number of burst Number of Z-offset Number of iteration Number of parallel lines Gap in between line Parameter file Comments Silicon 525µm Green(532nm/255mm) 200 kHz 100% 0,57 W 50 mm/s 1 burst none 4 1 N/A Silicon dicing green parameters Easily break silicon in cristal plan. Depth of the groove : 25µm Silicon (525µm) + Si3N4 (150nm up to 1,2µm) OR SiO2 (150nm up to 320nm) Red (1064nm/255mm) 200 kHz 100% 2,8 W 1000 mm/s 3 bursts 1 (-0,3mm) 350/100 4 50 µm Silicon nitride cutting parameters Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. Thicker layers (oxyde or nitride) have not been tested. Nickel (320µm) Green(532nm/255mm) 200 kHz 100% 0,64 W 300 mm/s 3 burst none 4320 1 N/A Cutting Ni 320µm parameters Cutting through only blue tape left Pyrex (1000µm) Red(1064nm/255mm) 200 kHz 100% 2,8 W 1000 mm/s 1 burst none 99 13 20 µm Cutting Pyrex 1000µm for microfluidic hole parameters Increase/decrease the number of iteration to increase/decrease the width of the hole. Microscope view of the chanel Pyrex/Borosilicate glass (525µm) Red(1064nm/255mm) 200 kHz 100% 2,96 W 1000 mm/s 1 burst 4 (-0,1/-0,2/-0,3/-0,4mm) 300/500/700/900/1200 4 20 µm Cutting Pyrex 525µm parameters Cutting through. Dicing circle. Steel (50µm) Green(532nm/255mm) 200 kHz 20% 0,55 W 50 mm/s 1 burst 0 22 Cutting steel 50µm Cutting shrim for Injection molder. Steel (100µm) Green(532nm/255mm) 200 kHz 25% 0,55 W 50 mm/s 1 burst 0 22 Cutting steel 50µm Cutting shrim for Injection molder. Steel (200µm) Green(532nm/255mm) 200 kHz 25% 0,55 W 50 mm/s 1 burst 0 50 Cutting steel 200µm Cutting shrim for Injection molder. Aluminum (400µm) Green(532nm/255mm) 200 kHz 100% ?? W 100 mm/s 3 bursts 0 35-40 4 20 cutting Al 400µm Cutting shadowmask for Wordentec. The parameter filename extension is here set to .xls because of MediaWiki restrictions. The 3DMM laser software uses .par as parameter file extension. The file should be a pure text-file with no formatting codes etc.