Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

@@ Line 127: / Line 127: @@
 |-
-| style="background:LightGrey; color:black"|Substrate material allowed
+!style="background:silver; color:black" align="left" valign="top" rowspan="1"|Substrates
+| style="background:LightGrey; color:black"|Process parameters
 |style="background:WhiteSmoke; color:black"|
-*Silicon, quartz, pyrex, III-V materials
-*Wafers with layers of silicon oxide or silicon (oxy)nitride
-*Wafers with layers of metal
+{| {{table}}
+| align="center" |
+{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:500px"
+! Parameters
+! Min
+! Max
+|-
+| Speed
+| -
+| 2000mm/s
+|
+|-
+| Fluence
+| 0,01J/cm2
+| 113J/cm2
+|-
+| Spot size
+| 10µm
+| 74µm
+|-
+|Pulse energy
+| 0,03µJ
+| 800 µJ
+|-
+| Pulse duration
+|10,4ps
+| 105000ps
+|-
+| Repetition rate
+| 200 kHz
+| 8000 kHz
+|-
+| Peak irradiance
+| 4GW/cm2
+| 5400 GW/cm2
 |}