Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
No edit summary |
|||
| Line 89: | Line 89: | ||
|style="background:LightGrey; color:black"|Output power @100%(laser TB width – picosecond) | |style="background:LightGrey; color:black"|Output power @100%(laser TB width – picosecond) | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | Repetition rate : 200kHz | ||
* 355nm : 11,93W | |||
* 532nm : 24,62W | |||
* 1064nm : 34,24W | |||
Repetition rate : 1000 kHz | |||
* 355nm : 4,28W | |||
* 532nm : 18,40W | |||
* 1064nm : 40,09W | |||
Repetition rate : 1000 kHz | |||
* 355nm : 0,26W | |||
* 532nm : 4,82W | |||
* 1064nm : 42,40W | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Scanning speed | |style="background:LightGrey; color:black"|Scanning speed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
| Line 127: | Line 144: | ||
|} | |} | ||
== Process information [[Image:section under construction.jpg|70px]] == | == Process information [[Image:section under construction.jpg|70px]] == | ||